DOW 6611B453 CORNING Q3-6611 BLACK 453G

Dow one-part heat cure (addition-curing) adhesives cure rate is rapidly accelerated with heat (see cure schedules in table) and an optimum cure schedule will balance processing performance and costs. For thicker sections or if voiding is observed the use of a 30-minute procure at 70°C (158°F) or the use of an adhesive with low-void technology may reduce voids. Addition-cure silicones are formulated with all necessary ingredients for cure and there are no by-products generated during the cure process. Deep-section or confined cures are possible as cure reactions progress evenly throughout the material. These adhesives generally have long working times so users can enjoy the greatest manufacturing flexibility and reduce waste. Dow silicone adhesives retain their original physical and electrical properties over a broad range of operating conditions which enhance the reliability of and service life of PCB system assemblies. The stable chemistry and versatile processing options of these adhesives offer benefits for a variety of needs from increasing component safety and reliability, reducing total cost or increasing the performance envelope of devices or modules. Underwriters Laboratory (UL) 94 recognition is based on minimum thickness requirements. Please consult the UL Online Certifications Directory for the most accurate certification information.